ISO7221ADR DATASHEET PDF

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. A binary input signal is conditioned, translated to a balanced signal, then differentiated by the capacitive isolation barrier. Part Number Starts with Contains Ends with Please enter a minimum of 3 valid characters alphanumeric, period, or hyphen. These devices are jsoadr for operation over the ambient temperature range of C to C. Specifications Contact Us Ordering Guides.

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All rights reserved. Added a row for the I-II specifications Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability. For the 3. For the 2. Figure Transition time is ps. In principle, a single-ended input signal entering the HF-channel is split into a differential signal via the inverter gate at the input.

The following capacitor-resistor networks differentiate the signal into transients, which then are converted into differential pulses by two comparators. The comparator outputs drive a NOR-gate flip-flop whose output feeds an output multiplexer. A decision logic DCL at the driving output of the flip-flop measures the durations between signal transients. If the duration between two consecutive transients exceeds a certain time limit, as in the case of a low-frequency signal , the DCL forces the output-multiplexer to switch from the high-frequency to the low-frequency channel.

Because low-frequency input signals require the internal capacitors to assume prohibitively large values, these signals are pulse-width modulated PWM with the carrier frequency of an internal oscillator, thus creating a sufficiently high frequency signal, capable of passing the capacitive barrier.

As the input is modulated, a low-pass filter LPF is needed to remove the high-frequency carrier from the actual data before passing it on to the output multiplexer. A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.

The power dissipation and junction-to-air thermal impedance of the ISOx and ISOx devices installed in the application hardware determines the junction temperature. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. Table 2. TI's customers are responsible for determining suitability of components for their purposes.

Customers should validate and test their design implementation to confirm system functionality. The supply voltage range is from 3 V 2. When designing with digital isolators, because of the single-ended design structure, digital isolators do not conform to any specific interface standard and are only intended for isolating single-ended CMOS or TTL digital signal lines.

The isolator is typically placed between the data controller that is, C or UART , and a data converter or a line transceiver, regardless of the interface type or standard. Isolated 4 to 20 mA Current Loop 9. The only external components are two bypass capacitors. The capacitors should be placed as close to the supply pins as possible. If only a single primary-side power supply is available in an application, isolated power can be generated for the secondary-side with the help of a transformer driver such as Texas Instruments SN data sheet.

Layer stacking should be in the following order top-to-bottom : high-speed signal layer, ground plane, power plane and low- frequency signal layer. If an additional supply voltage plane or signal layer is needed, add a second power or ground plane system to the stack to keep it symmetrical. Adding a second plane system to the stack makes the stack mechanically stable and prevents it from warping. The power and ground plane of each power system can be placed closer together, thus increasing the high-frequency bypass capacitance significantly.

FR-4 Flame Retardant 4 meets the requirements of Underwriters Laboratories ULV0, and is preferred over cheaper alternatives because of its lower dielectric losses at high frequencies, less moisture absorption, greater strength and stiffness, and self- extinguishing flammability characteristics. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 3. Linked contents are provided "AS IS" by the respective contributors. At e2e. Profibus is a trademark of Profibus. All other trademarks are the property of their respective owners. This glossary lists and explains terms, acronyms, and definitions. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document.

For browser-based versions of this data sheet, refer to the left-hand navigation. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

Samples may or may not be available. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free RoHS Exempt : This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.

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